Patent · US Active

Inline codeposition modular multi-flux evaporation source with integrated reactive vapor manifold

US12392036B1 · kind B1 · utility

0Cited by
1References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 22, 2022
Grant dateAug 19, 2025
Priority date
Expiry dateFeb 22, 2042

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10F77/126
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A method includes directing a first flux plume from a first evaporation source to a first reactive codeposition zone; directing a first vapor flux plume from a first vapor distribution manifold to the first reactive codeposition zone, wherein the first vapor distribution manifold is integrated with the first evaporation source to form a first integrated evaporation and vapor distribution manifold; directing a second flux plume from a second evaporation source to a second reactive codeposition zone; and directing a second vapor flux plume from a second vapor distribution manifold to the second reactive codeposition zone, wherein the second vapor distribution manifold is integrated with the second evaporation source to form a second integrated evaporation and vapor distribution manifold. An apparatus includes an inline reactive codeposition modular multi-flux evaporative source with integrated vapor manifold system comprising a first integrated evaporation and vapor distribution manifold including a first evaporation source emitting, when in operation, a first flux plume toward a first reactive codeposition zone; and a first vapor distribution manifold integrated with the first evapo…

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.