Optoelectronic component and method of manufacturing an optoelectronic component
US12392976B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2022 |
| Grant date | Aug 19, 2025 |
| Priority date | — |
| Expiry date | Dec 12, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/428
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optoelectronic component may include a substrate, an electronic integrated circuit supported by the substrate, and a photonic integrated circuit supported by the substrate. The optoelectronic component may include a plurality of substrate interconnect connectors disposed on the substrate, a plurality of electronic integrated circuit interconnect connectors disposed on the electronic integrated circuit, and a plurality of photonic integrated circuit interconnect connectors disposed on the photonic integrated circuit. The optoelectronic component may include a first plurality of cable connectors, each cable connector connected to the substrate, the electronic integrated circuit, and the photonic integrated circuit via respective interconnect connectors. The first plurality of cable connectors may be configured to facilitate electrical communication between the substrate, the electronic integrated circuit, and the photonic integrated circuit. The first plurality of cable connectors may define a first layout, and an overall connectivity of the optoelectronic component may correspond to the first layout.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.