Systems and methods for controlling thermal energy between hinged portions of electronic devices
US12393052B1 · kind B1 · utility
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15References
20Claims
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Key dates
| Filing date | May 16, 2022 |
| Grant date | Aug 19, 2025 |
| Priority date | — |
| Expiry date | Nov 28, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2027/0178
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method and system to conduct thermal energy between two hinged portions of an electric device. In examples, the method employs a thermal hinge system configured to transfer or spread thermal energy, and optionally electrical energy, through a mechanical articulation or hinge in an electronic device. A thermal hinge may include a thermally conductive living hinge, complementary and/or mating thermal interface components, or a combination of both.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.