Pattern forming method, photosensitive resin composition, cured film, laminate, and device
US12393116B2 · kind B2 · utility
0Cited by
9References
24Claims
0Family size
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Key dates
| Filing date | Jun 2, 2021 |
| Grant date | Aug 19, 2025 |
| Priority date | — |
| Expiry date | Dec 16, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
There is provided a pattern forming method that includes an exposure step of exposing a photosensitive film to laser light; and a development step of developing the photosensitive film after the exposure to obtain a pattern, where the photosensitive film contains at least one precursor selected from the group consisting of a polyimide precursor and a polybenzoxazole precursor, and an onium salt.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.