Apparatus for transferring electronic component, method for transferring electronic component and manufacturing method of light-emitting diode panel
US12394642B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 16, 2022 |
| Grant date | Aug 19, 2025 |
| Priority date | — |
| Expiry date | Jan 8, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for transferring an electronic component is configured to transfer an electronic component on a flexible carrier to a target substrate. The apparatus includes a first frame, a second frame, an abutment module, an actuator, and a negative pressure generating device. The abutment module includes an abutting component and a guide. The guide guides a movement of the abutting component. The actuator actuates the abutment module so that the abutting component and the guide are respectively moved between a start position and an end position of an abutment path. The negative pressure generating device is pumped through the abutment module. When the abutment module abuts against the flexible carrier, a negative pressure is generated between the abutment module and the flexible carrier by the negative pressure generating device. The abutting component and the guide are moved simultaneously in at least a portion of the abutment path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.