Test apparatus and method for a semiconductor device
US12394678B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2022 |
| Grant date | Aug 19, 2025 |
| Priority date | — |
| Expiry date | Mar 8, 2044 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2896
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of testing a semiconductor device includes forming conductive bumps respectively on a plurality of bonding pads of the semiconductor device. The semiconductor device having the conductive bumps is supported on a substrate stage. A gripper having first and second holders spaced apart from each other is positioned over the conductive bump. The conductive bump is clamped between the first and second holders. The gripper clamping the conductive bump is reciprocated at a constant speed with a predetermined stroke in a horizontal direction parallel with an upper surface of the substrate stage. A reliability of the semiconductor device is determined by measuring a time point at which a crack occurs in an upper wiring connected to the bonding pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.