Patent · US Active

Printed circuit board and circuit arrangement

US12396087B2 · kind B2 · utility

0Cited by

4References

19Claims

0Family size

Assignee

SEW-EURODRIVE GMBH & CO. KG · DE

Inventors

Jochen Mahlein · Karlsruhe, DE
Leobald Podbielski · Karlsruhe, DE
Martin Filsinger · Weierbach-Siedlung, DE

Key dates

Filing date	Sep 2, 2021
Grant date	Aug 19, 2025
Priority date	—
Expiry date	Jul 21, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/066
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A printed circuit board (PCB) includes a top side for receiving electrical components, a bottom side for receiving a heat sink, electrically conductive layers, and electrically insulating insulation layers. A main insulation layer is arranged between the top and bottom sides. The main insulation layer completely electrically insulates electrically conductive layers arranged between the main insulation layer and the top side from electrically conductive layers arranged between the main insulation layer and the bottom side. Upper plated through-holes extend from an outer insulation layer adjacent the top side into an inner insulation layer adjacent the main insulation layer. Lower plated through-holes extend from the bottom side into a lower insulation layer adjacent the main insulation layer. A circuit arrangement includes the printed circuit board, electrical components fitted to the top side and connected to the PCB, and heat sink(s) fitted to the bottom side and connected to the PCB.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.