Circuit board device
US12396096B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2023 |
| Grant date | Aug 19, 2025 |
| Priority date | — |
| Expiry date | Feb 28, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09827
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board device includes a transition region that includes a first conductive layer at a first level, a second conductive layer at a second level, and conductive vias. The first conductive layer includes a pad connected to the solderless connector, a transmission line, and a first reference layer. The transmission line includes first and second segments. A second width of the second segment is the same as or less than a first width of the first segment. The first reference layer has a first anti-pad region for the pad and the transmission line disposed therein. In a plan view, the first anti-pad region surrounding the pad is completely located within a second anti-pad region of a second reference layer of the second conductive layer. The conductive vias are disposed between the first and second conductive layers and surround the pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.