Patent · US Active

Fan module interconnect apparatus for electronic devices

US12396124B2 · kind B2 · utility

0Cited by

40References

14Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Chee How Lim · Hillsboro, US
Khai Ern See · Batu Gajah, MY
Chin Kung GOH · Merang, MY
Twan Sing Loo · Kampung Bukit Kechil, MY

Key dates

Filing date	Dec 23, 2020
Grant date	Aug 19, 2025
Priority date	—
Expiry date	Feb 5, 2043

Classification

Technology area (CPC G)Physics
CPC primaryG06F2200/201
WIPO fieldEngines, pumps, turbines
WIPO sectorMechanical engineering

Abstract

Fan module interconnect apparatus are disclosed. An example fan module includes a fan and a fan housing to carry the fan. The fan is to rotate in the fan housing. A flange extends from the fan housing and including signal paths to provide an interconnect to electrically couple at least portions of a first electrical circuit and a second electrical circuit of an electronic device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.