Two-phase immersion-cooling heat-dissipation structure having shortened evacuation route for vapor bubbles
US12396131B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2023 |
| Grant date | Aug 19, 2025 |
| Priority date | — |
| Expiry date | Dec 21, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20809
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A two-phase immersion-cooling heat-dissipation structure having shortened evacuation route for vapor bubbles includes an immersion-cooling substrate having a first surface and a second surface that are opposite to each other and immersion-cooling fins. The second surface contacts a heat source immersed in a two-phase coolant, and the first surface connects to the immersion-cooling fins. The immersion-cooling fins include at least one skived fin integrally formed on the first surface of the immersion-cooling substrate by skiving, and further include at least one functional fin. The functional fin is a single continuous fin extends lengthwise in a vapor bubbles evacuation direction, has a central portion corresponding in position to the heat source and upper and lower end portions located away from the heat source, and a height of the central portion is greater than at least one of a height of the upper and lower end portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.