Heatsink chassis with aerofoil
US12396134B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 29, 2022 |
| Grant date | Aug 19, 2025 |
| Priority date | — |
| Expiry date | Jul 29, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3672
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A chassis is provided for a circuit board, the chassis having a heatsink. The chassis includes a plurality of fins extending from the chassis for extracting heat from electronics mounted on the chassis. The plurality of fins are organized into at least two fin sections, wherein a first fin section has a first set of fins of the plurality of fins and a second fin section has a second set of fins of the plurality of fins. The chassis further provides a thermal break between the first fin section and the second fin section, the thermal break being an air gap between the first set of fins and the second set of fins. An aerofoil is then fixed in the air gap and inhibits air flow between the first fin section and the second fin section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.