Patent · US Active

Chip pad decompression structure

US12397172B2 · kind B2 · utility

0Cited by

1References

6Claims

0Family size

Inventors

Li-Chi Lin · Wang'an Town, TW
Yi-Ying Lin · Taichung, TW

Key dates

Filing date	Jan 9, 2023
Grant date	Aug 26, 2025
Priority date	—
Expiry date	Feb 21, 2044

Classification

Technology area (CPC A)Human Necessities
CPC primaryA61N2005/066
WIPO fieldMedical technology
WIPO sectorInstruments

Abstract

A chip pad decompression structure includes a pad, a protective ring, a chip, and an upper lid. A middle of one side of the pad has a raised portion. Another side of the pad has a recess. The protective ring is disposed in the recess of the pad. The protective ring has a through hole. The chip is disposed in the through hole of the protective ring and located in the recess of the pad. The upper lid is configured to cover the protective ring and the chip. The protective ring is disposed between the pad and the chip, which can disperse the force, improve a force-cushioning effect and protect the chip, so as to reduce a foreign body sensation and prolong the service life of the chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.