Honeycomb structure having improved thermal conductivity
US12397520B2 · kind B2 · utility
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4Claims
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Key dates
| Filing date | Mar 8, 2023 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | Jul 18, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2307/304
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A honeycomb structure having a core made up of a plurality of corrugated sheets which are superposed and adhesively bonded together is described. The corrugated sheets are made from a thermally insulating material. Bear filaments are made up of thermally conductive filaments. The honeycomb structure can be used when the ambient temperature exceeds, for example, 120° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.