Curing mold for a tire, comprising means for cutting a rubber mold seam
US12397522B2 · kind B2 · utility
0Cited by
5References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 16, 2021 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | Aug 30, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2030/006
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A curing mold (10) for a tire comprises: a plurality of circumferentially distributed sectors (18) that are intended to mold the tread of the tire, at least one sipe blade (40) intended to mold a void in the tread, the sipe blade extending over two adjacent sectors (18) such that the sipe blade comprises a part (40a, 40b) in each of the two sectors, the two parts of the sipe blade being separated, in the closed position of the mold, by a space (26) that creates flash during the curing of a tire, the parts of the sipe blade comprising cutting means (38) that are able to cut off the flash during the opening of the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.