Arrays including a resin film and a patterned polymer layer
US12398416B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 28, 2024 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | Feb 28, 2044 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC12Q1/68
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An example of an array includes a support, a cross-linked epoxy polyhedral oligomeric silsesquioxane (POSS) resin film on a surface of the support, and a patterned hydrophobic polymer layer on the cross-linked epoxy POSS resin film. The patterned hydrophobic polymer layer defines exposed discrete areas of the cross-linked epoxy POSS resin film, and a polymer coating is attached to the exposed discrete areas. Another example of an array includes a support, a modified epoxy POSS resin film on a surface of the support, and a patterned hydrophobic polymer layer on the modified epoxy POSS resin film. The modified epoxy POSS resin film includes a polymer growth initiation site, and the patterned hydrophobic polymer layer defines exposed discrete areas of the modified epoxy POSS resin film. A polymer brush is attached to the polymer growth initiation site in the exposed discrete areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.