Copper electroplating baths containing reaction products of amines, polyacrylamides and bisepoxoides
US12398479B2 · kind B2 · utility
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Key dates
| Filing date | Feb 4, 2020 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | Jun 8, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/38
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Copper electroplating baths include reaction products of amines, polyacrylamides and bisepoxides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.