Insulation structure, insulated piping device including the same, and method of fabricating the same
US12398838B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 13, 2022 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | Aug 4, 2043 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16L59/029
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
Insulation structures, insulated piping devices including the same, and methods of fabricating the same are disclosed. The insulation structure includes a first insulation layer on an outer surface of a pipe, a second insulation layer on an outer surface of the first insulation layer that includes a material different from a material of the first insulation layer, and a third insulation layer on an outer surface of the second insulation layer that includes a material different from the material of the second insulation layer. A thickness of the second insulation layer is greater than a thickness of the first insulation layer and a thickness of the third insulation layer. The second insulation layer includes a porous foam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.