Thermal module
US12398959B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2022 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | Jul 11, 2043 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D15/0233
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A thermal module includes a copper base seat, at least one U-shaped aluminum heat pipe, an aluminum radiating fin assembly and a copper embedding layer. The copper base seat has a heat absorption side and a heat conduction side. The heat absorption side or the heat conduction side is recessed to form at least one first heat pipe receiving channel. The U-shaped aluminum heat pipe has a horizontal section as a heat absorption section and two vertical sections as condensation sections. The heat absorption section is positioned in the first heat pipe receiving channel. The aluminum radiating fin assembly has multiple radiating fins. The copper embedding layer is disposed on a surface of the heat absorption section of the U-shaped aluminum heat pipe. By means of the copper embedding layer, two different materials can be directly welded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.