Agitation monitoring system for plating process
US12399006B2 · kind B2 · utility
0Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2022 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | Mar 8, 2044 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01C19/56
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present disclosure is directed to a monitoring system for a plating process using a monitoring device including a metrology component for collecting agitation intensity data on at least one agitation component within a plating equipment and transferring the collected agitation intensity data to a process control station.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.