Wafer test pad
US12399210B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2023 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | Feb 1, 2044 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2831
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A redistribution structure is provided. A redistribution structure according to the present disclosure includes a first dielectric layer, a mesh metal feature disposed in the first dielectric layer and including a base portion and a frame portion surrounding the base portion, a second dielectric layer disposed over the first dielectric layer and the mesh metal feature, a redistribution feature disposed over the second dielectric layer, a passivation structure disposed over the redistribution feature and the second dielectric layer, a pad opening extending through the passivation structure to expose a top surface of the redistribution feature. The redistribution feature includes a plurality of contact vias that extend through the second dielectric layer to land on the frame portion of the mesh metal feature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.