Fiber to silicon photonics assembly method with fiber retaining apparatus
US12399325B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 4, 2022 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | May 23, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/30
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present disclosure provides an optical fiber to silicon photonics circuit (PIC) assembly method utilizing a structured fiber retaining apparatus for fiber confinement in which polymer filling volume for adhesion and refractive index matching purpose is reduced. Reduction of polymer volume result in smaller optical alignment change due to polymer material volume changes upon moisture absorption and aging, hence improving assembly reliability. In an embodiment, the assembly method and apparatus, transparent polymer material interfaces between fiber and edged coupler volume reduce more than 50% compares to conventional assembly method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.