Semiconductor fabrication apparatus and method of using the same
US12399432B2 · kind B2 · utility
0Cited by
7References
20Claims
0Family size
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Key dates
| Filing date | Dec 22, 2021 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | Mar 13, 2044 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70308
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor fabrication apparatus and a method of using the same are disclosed. In one aspect, the apparatus includes a holder configured to place a substrate and a radiation source configured to provide radiation to transfer a pattern onto the substrate. The apparatus also includes a plurality of sensing devices configured to provide a reference signal based on an intensity of the radiation when the substrate is not present. The apparatus further includes a controller, operatively coupled to the plurality of sensing devices, configured to adjust the intensity of the radiation based on the reference signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.