Through-interposer grounding using blind vias
US12400921B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2022 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | Nov 9, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/49827
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A current path is provided through an interposer to ground a grounding pattern associated with a transmission line, by exploiting an interposer substrate that has a high-resistivity portion at a first surface and a low-resistivity portion extending from the high-resistivity portion to a second surface of the interposer. Moreover, a set of blind via-holes comprising electrically-conductive material extend from the first surface of the interposer substrate through the high-resistivity portion and into the low-resistivity portion. Top-to-bottom connection can be made using the conductive material in the blind vias and using the low-resistivity portion of the substrate, while the high-resistivity portion of the substrate impedes current leakage from the transmission line to the second surface of the substrate. The number and dimensions of the blind via-holes control the impedance of the grounding pattern relative to the transmission line's characteristic impedance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.