Circuit board assembly having circuit board with adjacent chips immersed in dielectric liquid and method of making the same
US12400946B2 · kind B2 · utility
0Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 10, 2024 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | May 10, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10522
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board assembly is provided. The circuit board assembly includes a circuit board and a plurality of chips assembled on a surface of the circuit board. The plurality of chips include integrated circuit (IC) chips. At least two chips are positioned on the surface of the circuit board adjacent to one another with a spacing separating the two chips that is less than a minimum dimension of each of the two chips. A circuit board and a method for circuit board assembly are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.