Package comprising integrated devices and bridge coupling top sides of integrated devices
US12400966B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2023 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | Oct 23, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/1058
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package comprising a substrate; a first integrated device coupled to the substrate through at least a first plurality of solder interconnects; a second integrated device coupled to the substrate through at least a second plurality of solder interconnects; a first bridge coupled to the first integrated device and the second integrated device through at least a third plurality of solder interconnects, wherein the first bridge is configured to provide at least one first electrical path between the first integrated device and the second integrated device, and wherein the first bridge is coupled to a top portion of the first integrated device and a top portion of the second integrated device, through at least the third plurality of solder interconnects; and a second bridge coupled to the first integrated device and the second integrated device through a fourth plurality of solder interconnects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.