Semiconductor package including electromagnetic shield structure
US12400970B2 · kind B2 · utility
0Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 16, 2022 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | Feb 26, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes; a package substrate, a semiconductor chip on the package substrate, an electromagnetic shield structure on the package substrate and including an upper cover covering an upper surface of the semiconductor chip and a side cover surrounding the semiconductor chip, and a sealing member contacting the semiconductor chip and the electromagnetic shield structure, wherein the side cover includes first through holes and the upper cover includes second through holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.