Light emitting diode array containing a black matrix and an optical bonding layer and method of making the same
US12401002B2 · kind B2 · utility
0Cited by
4References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 21, 2023 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | Oct 26, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/871
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting device includes a backplane, an array of light emitting diodes attached to a front side of the backplane, a transparent conductive layer contacting front side surfaces of the light emitting diodes, an optical bonding layer located over a front side surface of the transparent conductive layer, a transparent cover plate located over a front side surface of the optical bonding layer, and a black matrix layer including an array of openings therethrough, and located between the optical bonding layer and the transparent cover plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.