Patent · US Active

Surface-acoustic-wave (SAW) filter with dielectric material disposed in a piezoelectric layer

US12401339B2 · kind B2 · utility

0Cited by

3References

24Claims

0Family size

Assignee

RF360 Singapore Pte. Ltd. · SG

Inventors

Michael Merker · Munich, DE
Stefan Ammann · Winterthur, CH
Marc Esquius Morote · Munich, DE
Matthias PERNPEINTNER · Grafing, DE

Key dates

Filing date	Jun 13, 2022
Grant date	Aug 26, 2025
Priority date	—
Expiry date	Mar 31, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH03H2009/02299
WIPO fieldBasic communication processes
WIPO sectorElectrical engineering

Abstract

An apparatus is disclosed for implementing a surface-acoustic-wave (SAW) filter with dielectric material disposed in a piezoelectric layer. In an example aspect, the apparatus includes a surface-acoustic-wave filter with a piezoelectric layer, an electrode structure, and dielectric material. The piezoelectric layer has at least one channel. The dielectric material is disposed in the at least one channel of the piezoelectric layer and is at least partially covered by the electrode structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.