Acoustic wave device with multi-layer piezoelectric substrate with heat dissipation
US12401340B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2024 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | Jun 21, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/6413
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Aspects of this disclosure relate to a filter that includes an acoustic wave device with a multi-layer substrate with heat dissipation. The multi-layer substrate includes a support substrate (e.g., a quartz substrate), a piezoelectric layer, an interdigital transducer electrode on the piezoelectric layer, and a thermally conductive layer configured to dissipate heat associated with the acoustic wave device. The thermally conductive layer is disposed between the support substrate and the piezoelectric layer. The thermally conductive layer has a thickness that is greater than 10 nanometers and less than a thickness of the piezoelectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.