Stacked acoustic wave (AW) packages with reduced excitation of reflected bulk waves

US12401345B2 · kind B2 · utility

Assignee

• RF360 Singapore Pte. Ltd. · SG

Inventors

• Peter Kirchhofer · Munich, DE
• Simone Colasanti · Bayern, DE
• Nadine Erhard-Egeler · Munich, DE
• Franz Kubat · Munich, DE
• Volker Schulz · Heppenheim, DE
• Philipp Schwegler · Peising, DE

Key dates

• Filing date: Sep 1, 2022
• Grant date: Aug 26, 2025
• Expiry date: Jul 21, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H03H9/6443
• WIPO field: Basic communication processes
• WIPO sector: Electrical engineering

Abstract

Aspects of the disclosure relate to devices, wireless communication apparatuses, methods, and circuitry implementing bulk wave suppression in a stacked electroacoustic device. One aspect includes a first substrate comprising a first surface and a second surface, where the second surface is opposite the first surface, a first AW resonator circuit positioned on the first surface of the first substrate, a plurality of elements including a first element, where the plurality of elements are positioned on the second surface of the first substrate, and where the first element is aligned with the first AW resonator circuit, and a second substrate comprising a first surface and a second surface, where the plurality of elements are positioned on the first surface of the second substrate, and where the plurality of elements create a cavity between the first substrate and the second substrate.