Wiring substrate
US12402248B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2023 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | Apr 27, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wiring substrate includes a core substrate including a core insulating layer, a first conductor layer, a second conductor layer, a first insulating layer, a second insulating layer, a third conductor layer, and a fourth conductor layer. The first conductor layer includes first land and first plane parts, the second conductor layer includes second land and second plane parts, the third conductor layer includes fine wirings and a third plane part, the fourth conductor layer includes fine wirings and a fourth plane part, the substrate includes a through-hole conductor connecting the first and second land parts through the core insulating layer, a first via conductor connecting the first land part and third conductor layer, a second via conductor connecting the second land part and fourth conductor layer, a third via conductor connecting the first and third plane parts, and a fourth via conductor connecting the second and fourth plane parts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.