Method for producing electronic component mounted substrate
US12402255B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2022 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | Mar 10, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0445
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A disclosed method for manufacturing an electronic-component-mounted substrate includes: a step (i) of forming a temporary fixing film (13) in such a manner as to cover a plurality of solder precoats (11) formed on a plurality of lands (10b) on a substrate and an antioxidation film (12) formed in such a manner as to cover the solder precoats; a step (ii) of disposing a plurality of electronic components (30) on the plurality of solder precoats (11) via the antioxidation film (12) and the temporary fixing film (13); and a step (iii) of soldering the plurality of electronic components (30) to the lands (10b) by melting the plurality of solder precoats (11). The antioxidation film (12) contains a first thermoplastic resin. The temporary fixing film (13) contains an activating agent and a second thermoplastic resin. The softening point of the first thermoplastic resin is equal to or lower than the softening point of the second thermoplastic resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.