Heat dissipation assembly for a terminal device
US12402281B2 · kind B2 · utility
0Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2023 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | Mar 14, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M1/026
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments of this application provide a terminal device, including a middle frame, a heat source device, a first heat dissipation assembly, and a second heat dissipation assembly, where the first heat dissipation assembly is disposed on one side of the middle frame, the heat source device and the second heat dissipation assembly are disposed on the other side of the middle frame, and at least one of the first heat dissipation assembly and the second heat dissipation assembly is a graphene heat dissipation assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.