Semiconductor device
US12402381B2 · kind B2 · utility
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13Claims
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Assignee
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Key dates
| Filing date | Jul 12, 2022 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | Jan 14, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/106
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a semiconductor device including: at least a semiconductor layer having a corundum structure, the semiconductor layer including a first surface having at least a first side and a second side shorter than the first side, the first surface being a c-plane or an m-plane, a direction of the first side being a direction of a c-axis or a direction of an m-axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.