Integrated circuit structures including a titanium silicide material
US12402387B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2024 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | Jun 7, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Approaches for fabricating an integrated circuit structure including a titanium silicide material, and the resulting structures, are described. In an example, an integrated circuit structure includes a semiconductor fin above a substrate, a gate electrode over the top and adjacent to the sidewalls of a portion of the semiconductor fin. A titanium silicide material is in direct contact with each of first and second epitaxial semiconductor source or drain structures at first and second sides of the gate electrode. The titanium silicide material is conformal with and hermetically sealing a non-flat topography of each of the first and second epitaxial semiconductor source or drain structures. The titanium silicide material has a total atomic composition including 95% or greater stoichiometric TiSi2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.