Flip chip type light emitting device
US12402449B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2023 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | Oct 17, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/831
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A light emitting device includes a substrate including a roughened surface; a light emitter disposed on the substrate, which includes a first conductivity layer; and a mesa disposed on a partial region of the first conductivity layer. An ohmic electrode can be disposed on the mesa; and a contact electrode can be disposed on the first conductivity layer. The light emitting device further includes a first reflection layer; a first pad electrode and a second pad electrode; and a second reflection layer. The first reflection layer covers at least a portion of the light emitter, the ohmic electrode and the contact electrode. The second reflection layer is disposed on an opposite side of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.