Method for cutting substrate elements
US12403627B2 · kind B2 · utility
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2References
22Claims
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Key dates
| Filing date | Mar 22, 2023 |
| Grant date | Sep 2, 2025 |
| Priority date | — |
| Expiry date | Nov 14, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/38
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
In a method, substrate elements are provided wherein each substrate element has a first side and a second side meeting at a corner point. The substrate elements are picked and then placed on a support device in alignment. A cutting operation is then performed where each of the substrates elements are cut along a cut line having a common first direction which intersects the first and second sides of each of the substrate elements in order to create a third side on each substrate element. The third side of each of the substrate elements meets the first and the second sides at corresponding corner points.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.