Curable resin system
US12404362B2 · kind B2 · utility
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11References
11Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 18, 2018 |
| Grant date | Sep 2, 2025 |
| Priority date | — |
| Expiry date | Feb 11, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2363/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present disclosure provides a curable resin system containing an alkylated glycidyl amine and a phenylindane diamine. The curable resin system may be cured at relatively low temperatures to produce cured products having desirable physical, thermal and chemical properties for use in various applications including composites for the aerospace and automotive industries.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.