Photothermal analysis of a part of solid material
US12405239B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 28, 2020 |
| Grant date | Sep 2, 2025 |
| Priority date | — |
| Expiry date | Nov 19, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J2005/0077
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of photothermal analysis of a solid piece includes injecting heat into a region of a surface of the piece, called heating region, capturing a thermal analysis image of a detection region which is distinct from the heating region, then subtracting a reference image from the thermal analysis image. The reference image corresponds to a thermal emission distribution as caused by the injected heat for a case where the surface portion of the piece is without defects. Such method makes it possible to reduce an analysis cycle time for the piece, and to reduce a signal-to-noise ratio of images capable of revealing defects present in the surface portion of the piece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.