Electroplated materials and array design for scintillators
US12405392B1 · kind B1 · utility
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6References
18Claims
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Key dates
| Filing date | Apr 25, 2023 |
| Grant date | Sep 2, 2025 |
| Priority date | — |
| Expiry date | Jul 30, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01T1/2023
- WIPO fieldEnvironmental technology
- WIPO sectorChemistry
Abstract
Embodiments provide for scintillator grid array and a method of manufacturing the same. An example method includes preparing a plurality of substrates each comprising a first material, depositing a layer of a second material onto each of the plurality of substrates to produce a plurality of electroplated substrates, pressing the plurality of electroplated substrates into a grid array, dissolving the first material from the electroplated substrates of the grid array, and placing scintillator crystals into the grid array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.