Electronic device and method of fabricating electronic device
US12408273B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 18, 2022 |
| Grant date | Sep 2, 2025 |
| Priority date | — |
| Expiry date | Nov 18, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4644
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device is provided. The electronic device includes electric components in an effective area; and a retaining structure substantially surrounding a boundary of the effective area. The electronic device includes a base substrate, and multiple conductive layer and multiple insulating layers alternately stacked on the base substrate. The retaining structure is configured to enhance adhesion between conductive layers adjacent to each other in the electronic device. The retaining structure includes one or more retaining layers. A respective retaining layer of the one or more retaining layers is in direct contact with at least one insulating layer of the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.