Immersion cooling system and electronic apparatus having the same and pressure adjusting module
US12408299B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2021 |
| Grant date | Sep 2, 2025 |
| Priority date | — |
| Expiry date | Mar 21, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An immersion cooling system includes a box body, a condensing structure and a pressure adjusting module. The box body has a first containing space, the first containing space is adapted to contain a heat dissipation medium, and at least one heat generating component is disposed in the first containing space to be immersed in the heat dissipation medium which is in liquid state. The condensing structure is disposed in the first containing space and above the heat dissipation medium which is in liquid state. The pressure adjusting module is adapted to actively drive a fluid in the first containing space to flow into the second containing space, such that a pressure in the first containing space is reduced to be less than an external pressure. In addition, an electronic apparatus having the immersion cooling system and a pressure adjusting module are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.