High-temperature resistant solid-state relay
US12408304B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2025 |
| Grant date | Sep 2, 2025 |
| Priority date | — |
| Expiry date | Mar 4, 2045 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10166
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided is a high-temperature resistant solid-state relay including a bottom board, a switch component, a PCB, a frame body, a top cover and a heat dissipation rack fixed with the bottom board. An upper surface of the bottom board is fixed with the switch component; the frame body is fixed with the bottom board; the PCB is embedded in the frame body; and the switch component is connected with the PCB. The PCB is provided with a large output copper column, a large input copper column, a small output control signal copper column and a small input control signal copper column. The top cover is located above the frame body. The bottom board is made of a first high-temperature resistant material; the heat dissipation rack, the frame body, the PCB and the top cover are made of a second high-temperature resistant material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.