Interconnected electrode structure having multi-conductive through hole and method of manufacturing same

US12408475B2 · kind B2 · utility

Assignee

• SUZHOU INSTITUTE OF NANO-TECH AND NANO-BIONICS (SINANO) , CHINESE ACADEMY OF SCIENCES · CN

Inventors

• Jian Lin · Reading, GB
• Hao Zhang · Shanghai, CN
• Jing Wang · State College, US
• Zhenguo Wang · Ridgewood, US
• Qun Luo · Beijing, CN
• Chao Gong · Beijing, CN
• Changqi Ma · Suzhou, CN

Key dates

• Filing date: Dec 27, 2021
• Grant date: Sep 2, 2025
• Expiry date: Jan 9, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K30/83

Abstract

An interconnected electrode structure is provided. The interconnected electrode structure includes an insulating base material, a through hole, a first conductive body, and a second conductive body. The insulating base material includes a first surface and a second surface which face away from each other. The through hole penetrates through the insulating base material in a thickness direction. The first conductive body is formed by conductive slurry that enters the through hole from an opening of the through hole on the first surface. The second conductive body is formed by a second conductive material that enters the through hole from an opening of the through hole on the second surface, and the second conductive body is electrically combined with the first conductive body to form a conductive channel in the insulating base material.