Patent · US Active

Patterned deposition mask formed using polymer dispersed in a liquid solvent

US12408496B2 · kind B2 · utility

0Cited by
0References
20Claims
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Key dates

Filing dateOct 25, 2022
Grant dateSep 2, 2025
Priority date
Expiry dateJul 25, 2043

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10H29/0361
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A polymer dispersion layer is formed on a substrate or semiconductor light-emitting devices on the substrate. After forming the polymer dispersion layer, drying and curing the polymer dispersion layer forms a cured polymer layer. After curing and drying, with the cured polymer layer being present on only selected, masked areas of the substrate or light-emitting devices, and with other areas of the substrate or light-emitting devices lacking the cured polymer layer and remaining exposed, a material layer is formed on at least the exposed areas of the substrate or light-emitting devices. After forming the material layer, the cured polymer layer is removed from the masked areas, leaving the material layer on the exposed areas.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.