Patterned deposition mask formed using polymer dispersed in a liquid solvent
US12408496B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2022 |
| Grant date | Sep 2, 2025 |
| Priority date | — |
| Expiry date | Jul 25, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H29/0361
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A polymer dispersion layer is formed on a substrate or semiconductor light-emitting devices on the substrate. After forming the polymer dispersion layer, drying and curing the polymer dispersion layer forms a cured polymer layer. After curing and drying, with the cured polymer layer being present on only selected, masked areas of the substrate or light-emitting devices, and with other areas of the substrate or light-emitting devices lacking the cured polymer layer and remaining exposed, a material layer is formed on at least the exposed areas of the substrate or light-emitting devices. After forming the material layer, the cured polymer layer is removed from the masked areas, leaving the material layer on the exposed areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.