Bonded abrasive with low wetting bond material
US12409530B2 · kind B2 · utility
0Cited by
10References
10Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Nov 3, 2023 |
| Grant date | Sep 9, 2025 |
| Priority date | — |
| Expiry date | Nov 3, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/0072
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The subject application relates to bonded abrasive with low wetting bond material. An abrasive article including a bonded abrasive body having a particular MOR/EMOD ratio associated with a particular bond vol %. The body also can include a) an average Bond Post Area (BPA) of not greater than microns2; b) an average Bond Post Count (BPC) of at least 140 per 1536 mm2; c) an average bond wetting radius of at least 30/microns; or d) a combination of a) and b).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.