Tunable system and method for stress resolution in additive manufacturing
US12409609B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Aug 14, 2023 |
| Grant date | Sep 9, 2025 |
| Priority date | — |
| Expiry date | Sep 28, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Systems and methods resolve stresses in additive manufacturing. A stress resolution profile including frequency and amplitude parameters of an ultrasonic input are determined based on physical properties of the product. Successive layers of a material are added and energy is applied to incorporate the material of each layer into the product. An ultrasonic input is applied with the determined parameters to resolve stress as the product is built up. The ultrasonic input is varied as a depth of the material incorporated into the product increases.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.