Wafer alignment features
US12409619B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2020 |
| Grant date | Sep 9, 2025 |
| Priority date | — |
| Expiry date | Feb 17, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B13/0085
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing a plurality of optical elements includes providing a first wafer (200) having lower alignment features (192) arranged on a first surface of the substrate, providing a second wafer (201) comprising, on a replication side, a plurality of replication sections, each replication section defining a surface structure of one of the optical elements, the second wafer (201) further comprising upper alignment features (194) protruding, on the replication side, further than an outermost feature of the replication sections, depositing liquid droplets (196) on the first side of the first wafer (200), and bringing the second wafer (201) and the first side of the first wafer (200) together, with liquid droplets (196) between the first wafer (200) and the second wafer (201), the upper alignment features (194) contacting the liquid droplets (196) on the lower alignment features (192) on the first side of the first wafer (200), and thereby causing the second wafer (201) to align with the first wafer (200) by capillary action.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.