Die assembly and method of forming a vinyl record
US12409620B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 1, 2023 |
| Grant date | Sep 9, 2025 |
| Priority date | — |
| Expiry date | Dec 29, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2017/003
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A die assembly and a method of forming a vinyl record are provided. The assembly includes a base circular-shaped plate having an outer ring-shaped gasket groove, an inner O-ring groove, and a plurality of concentric grooves extending from a primary surface into the base circular-shaped plate. The assembly includes an O-ring that is disposed in the inner O-ring groove, and an outer ring-shaped gasket disposed in the outer ring-shaped gasket groove. The assembly includes a contacting circular-shaped plate having an engagement surface and a plurality of concentric channels such that a plurality of concentric finger portions are formed on the contacting circular-shaped plate. The plurality of concentric finger portions are partially disposed in the plurality of concentric grooves and contact the base circular-shaped plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.