Lamination apparatus and lamination method
US12409645B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2023 |
| Grant date | Sep 9, 2025 |
| Priority date | — |
| Expiry date | Apr 26, 2044 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B37/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A lamination apparatus is adapted to laminate an encapsulation glue and a panel. The lamination apparatus includes a lower mold, an upper mold, and a cutting knife. The lower mold has a lamination area and a peripheral area adjacent to the lamination area. The panel is adapted to be retained in the lamination area. The upper mold is movable close to or away from the lower mold, and includes an encapsulation glue fixing part. The encapsulation glue fixing part is adapted to fix the encapsulation glue to the upper mold. The cutting knife is disposed in the peripheral area of the lower mold, and is located in a horizontal direction between the lamination area of the lower mold and the encapsulation glue fixing part of the upper mold. In addition, a lamination method is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.